Transparent, curved, and highly polished lenses pose unique challenges that require specialized solutions.
Defects can vanish without the right light path. Specular reflections & AR coatings create glare that hides sleeks and stains.
Spherical/toric surfaces introduce refraction, changing apparent defect shape and position.
Engravings & ink markings are faint, tiny, and easily worn. Edge micro-chips affect mounting and optics.
Every PASS lens receives a Digital Quality Certificate (DQC) with complete inspection records.
Precision-engineered components working in harmony to deliver unmatched inspection accuracy
Integrate with electronic lensometer to log sphere, cylinder, axis, prism and reconcile with job ticket
Measure optical center vs. engravings/fitting cross; compute base/apex and magnitude
Check engraving positions, corridor length, PRP/DRP/NRP distances to tolerance
Comprehensive defect detection across all critical lens characteristics
Flexible implementation to match your infrastructure and quality management needs
For real-time control and data residency requirements with local processing
Centralized DQC management with cross-plant benchmarking and analytics
Spot checks and field returns analysis with companion mobile application
Answers to common questions about our spectacle lens inspection solution
Yes. Coaxial bright‑field with cross‑polarization suppresses glare and reveals pinholes, haze, and stains. Dark‑field adds sensitivity to sleeks.
Yes. The system detects and measures engravings/ink marks, verifies fitting cross/PRP positions, corridor length, and mark spacing against the recipe.
We can integrate with an automated lensometer to capture sphere/cylinder/axis/prism and attach readings to the DQC.
Telecentric backlight metrology and dual‑camera setups measure CT/ET and compute wedge angle with high repeatability.
Uniform dome lighting with colorimetry provides ΔE maps for tint uniformity; optional UV stimulus characterizes photochromic kinetics.
Yes. We offer post‑edging stations to verify bevel chips, diameter, and geometry before assembly.
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