Intelgic replaces manual microscopic inspection of ultra-miniature SMDs (0201: ~0.6×0.3 mm, 0402: ~1.0×0.5 mm) with a high-resolution imaging system and AI-powered defect detection that reliably catches sub-10 µm issues—at production speed.
Manual microscope inspection is slow, subjective, and hard to scale. Tiny variations in lighting, fatigue, or interpretation lead to misses and false rejects—especially on dense PCBs packed with 0201/0402 parts. Intelgic’s automated AOI station delivers repeatable, objective results, integrates with your line, and generates digital records for audits and warranties.
Offset/shift, rotation, skew, tombstoning, tilt
Insufficient/excess solder, bridging, opens, voids, wetting issues
Micro-cracks, cold joints, fillet shape anomalies
Missing/polarity wrong, counterfeit/marking mismatch (OCR), package damage
Fibers, dust, flux residues, solder balls
Pad damage, solder mask delamination, mask encroachment
Panel enters station; fiducials auto-align the field of view.
The system executes a scan path; lighting modes switch to expose different defect signatures.
Models classify/segment defects, compute metrics, and apply acceptance criteria.
PASS/FAIL per component, with optional mark/reject/stop-line outputs.
Results stored with timestamps, images, measurements, lot/serial; DQC issued for PASS boards.
< 10 µm (application-dependent; optics & lighting optimized per board)
±5–10 µm typical with telecentric optics
Reduced vs. rules-based AOI through learned normal-appearance modeling
New product recipe loading in minutes; model fine-tuning supported
Aspect | Manual Microscope | Intelgic AOI |
---|---|---|
Consistency | Operator-dependent | AI criteria, repeatable |
Speed | Slow; non-scalable | Inline, panel-level fast scans |
Sensitivity | Limited by fatigue | Sub-10 µm with high-mag optics |
Records | Sparse notes/photos | Full image & metric archive + DQC |
Changeover | Retrain humans | Load recipe; optional quick re-train |
Cost of Quality | High rework/escape risk | Lower false rejects & escapes |
Yes. Most customers migrate to automated AOI for primary decisions and keep minimal spot-checks for audit.
No. We bootstrap with good-only anomaly models and incrementally add labeled defect data to refine classes.
We mitigate with coaxial + polarized + darkfield lighting and train models on varied exposures for robustness.
Yes. We design the scan path, FOV tiling, and inference pipeline to your cycle time; parallel cameras are available for high-throughput lines.
Telecentric optics, stage calibration, and per-recipe scale validation (grid targets) ensure µm-accurate metrology.
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